Prototyping solutions · December 2, 2021
Through-hole plating methods compared
LPKF offers three through-hole plating solutions, each with its own advantages. The application determines the best-suited method: substrate size and circuit dimensions matter, but so do the substrate material and the type of board.
LPKF ProConduct
A versatile manual method with no chemical baths. ProConduct relies on a special conductive paste that coats drilled holes simply, in a few minutes.
LPKF Contac S4
Professional galvanic plating by reverse pulse plating. The Contac S4 is an all-in-one system that requires no chemistry expertise to operate.
LPKF EasyContac
A simple manual method for low volumes. Compact and portable, EasyContac is the entry-level system for plating prototypes.
| Application | EasyContac | Contac S4 | ProConduct |
|---|---|---|---|
| Low volume, few holesFewer than 50 holes: EasyContac is designed for this need, although the other two are also suitable. | ✓ | — | — |
| Low volume, many holesAn unlimited number of holes, plated quickly. | — | ✓ | ✓ |
| Medium production volumesFully plated vias on boards of all shapes and sizes. | — | ✓ | — |
| Difficult surfacesDemanding substrates, such as pure PTFE. | — | ✓ | ✓ |
| RF and microwave circuitsStrict geometric constraints of microwave circuits. | — | ✓ | ✓ |
| Tin platingThe Contac S4 includes a tin-plating bath. | — | ✓ | — |
| No chemistryWhen chemical processes are ruled out or restricted. | ✓ | — | ✓ |
| High-power circuitsLarger holes and thicker copper layers. | — | ✓ | — |
| Reverse pulse platingUniform copper deposition, with no buildup or clogging at the hole entrance. | — | ✓ | — |
