
LPKF EasyContac
The entry level.
Compact and portable: the simple solution for low volumes and boards with few holes.
LPKF prototyping · Through-hole plating
Double-sided or multilayer: three LPKF processes to plate your holes and vias, from manual kit to automated galvanic system.
Rivets, conductive paste or galvanic plating: the right process depends on your volumes, materials and chemical constraints. Let’s talk.

The entry level.
Compact and portable: the simple solution for low volumes and boards with few holes.

The fast one, RF-friendly.
A conductive paste drawn into the holes and then cured: plated vias in minutes, PTFE materials included.

The professional benchmark.
Six cascaded baths in a compact unit, touchscreen wizard, integrated microvia cleaning and tin plating: uniform deposition, even in multilayers.
Demo
Every lab is unique. Tell us about your volumes, materials and constraints: one of our specialists will get back to you and point you to the right process.
Few holes or many, PTFE, high power, no chemistry? Our comparison of plating methods.
Read the comparison