
ProtoLaser H4
Laser and mechanics on one benchtop.
Laser structuring plus mechanical drilling and depaneling in a single compact system.
LPKF prototyping · Laser structuring
Straight edges true to the design, ultra-fine tracks, no tools to wear out: LPKF ProtoLaser systems remove copper by laser, straight from your design files.
All ProtoLaser systems are Class 1 lasers driven by LPKF CircuitPro software. The right choice depends on your materials, feature sizes and volumes: let’s talk.

Laser and mechanics on one benchtop.
Laser structuring plus mechanical drilling and depaneling in a single compact system.

The fast one.
High throughput on standard laminates, for back-to-back prototypes.

The all-rounder.
The widest range of substrates, from laminates to flex, with drilling and depaneling.

“Cold” ablation.
Ultrashort pulses vaporize material before heat can spread: for sensitive materials, ceramics and thin films.
Demo
Every application is unique. Tell us about your materials, feature sizes and volumes: one of our specialists will get back to you and point you to the right source.